User:Starcrescent/Books/Make Computer 8
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Make Computer 8
MOS Manufacturing
- Semiconductor device fabrication
- Acetone
- Trichloroethylene
- Ultrapure water
- Piranha solution
- RCA clean
- Passivation (chemistry)
- Photolithography
- Ion implantation
- Dopant
- Etching (microfabrication)
- Dry etching
- Plasma etching
- Reactive-ion etching
- Deep reactive-ion etching
- Atomic layer etching
- Buffered oxide etch
- Plasma ashing
- Rapid thermal processing
- Furnace anneal
- Thermal oxidation
- Chemical vapor deposition
- Atomic layer deposition
- Physical vapor deposition
- Molecular-beam epitaxy
- Electroplating
- Chemical-mechanical polishing
- Wafer testing
- Automatic test equipment
- Laser trimming
- Die preparation
- Through-silicon via
- Dicing tape
- Wafer backgrinding
- Wafer bonding
- Microelectromechanical systems
- Nanoelectromechanical systems
- Redistribution layer
- Wafer-level packaging
- Flip chip
- Ball grid array
- Wafer dicing
- Integrated circuit packaging
- Wire bonding
- Thermosonic bonding
- Tape-automated bonding
- Lead frame
- Soldering
- Wright etch
- Chemistry of photolithography
- Contact lithography
- Epitaxy
- Molecular diffusion
- Doping (semiconductor)
- Extreme ultraviolet lithography
- Computational lithography
- Foundry model
- Immersion lithography
- LOCOS
- Microfabrication
- Czochralski method
- Crystal growth
- Mask (computing)
- Nanoimprint lithography
- Nanolithography
- Next-generation lithography
- Monocrystalline silicon
- Polycrystalline silicon
- Stepper
- Semiconductor equipment sales leaders by year
- Semiconductor fabrication plant
- Semiconductor industry
- Applied Materials