Digital image correlation for electronics
Digital image correlation analyses have applications in material property characterization, displacement measurement, and strain mapping.[1] As such, DIC is becoming an increasingly popoular tool when evaluating the thermo-mechanical behavior of electronic components and systems. Cite error: The <ref> tag name cannot be a simple integer (see the help page).
CTE Measurements and Glass Transition Temperature Identification
The most common application of DIC in the electronics industry is the measurement of coefficient of thermal expansion (CTE). Because it is a non-contact, full-field surface technique, DIC is ideal for measuring the effective CTE of printed circuit boards and individual surfaces of electronic components. Cite error: The <ref> tag name cannot be a simple integer (see the help page).
Out-of-Plane Component Warpage
Thermo-mechanical Strain Mapping
- ^ [Correlated Solutions – Applications. http://correlatedsolutions.com/applications/]