IEEE Transactions on Advanced Packaging
IEEE_Transactions_on_Advanced_and_Packaging
 | IEEE T Adv. Packaging doesn't exist. |
| IEEE T Adv Packaging doesn't exist. |
| Discipline | multi-chip modules, wafer-scale integration, |
|---|---|
| Language | English |
| Edited by | Ganesh Subbarayan |
| Publication details | |
Former name(s) | IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing |
| History | 1999-2010 |
| Publisher | |
| Frequency | Quarterly |
| 1.276 (2010) | |
| Standard abbreviations | |
| ISO 4 | IEEE T Adv. Packaging |
| Indexing | |
| CODEN | IMTBE4 |
| ISSN | 1521-3323 |
| LCCN | 2005215261 |
| OCLC no. | 39742480 |
IEEE Transactions on Advanced Packaging was a peer-reviewed scientific journal published by the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling and applications of multi-chip modules, wafer-scale integration and other topics in . It was established in 1999. This Transaction ceased production in 2010. The last editor was Ganesh Subbarayan.
The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.