IEEE Transactions on Advanced Packaging
IEEE_Transactions_on_Advanced_and_Packaging
 | IEEE T Adv. Packaging doesn't exist. |
| IEEE T Adv Packaging doesn't exist. |
| Discipline | multi-chip modules, wafer-scale integration, semiconductor packaging |
|---|---|
| Language | English |
| Edited by | Ganesh Subbarayan |
| Publication details | |
Former name(s) | IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing |
| History | 1999-2010 |
| Publisher | |
| Frequency | Quarterly |
| 1.276 (2010) | |
| Standard abbreviations | |
| ISO 4 | IEEE T Adv. Packaging |
| Indexing | |
| CODEN | IMTBE4 |
| ISSN | 1521-3323 |
| LCCN | 2005215261 |
| OCLC no. | 39742480 |
IEEE Transactions on Advanced Packaging was a peer-reviewed scientific journal published by the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling and applications of multi-chip modules, wafer-scale integration and other topics in semiconductor packaging. It was established in 1999. This Transaction ceased production in 2010. The last editor was Ganesh Subbarayan.
The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.
See also
External links
Category:IEEE academic journals
Category:Physics journals
Category:Quarterly journals
Category:Publications established in 1999
Category:English-language journals
Category:Engineering journals
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