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Talk:Land grid array

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This is an old revision of this page, as edited by Plugwash (talk | contribs) at 00:01, 22 March 2006 (bga). The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.

"The new socket has had numerous problems with heat dissipation, and bent pins in motherboards." I'm not sure if this is fully true, I have never experienced or read anything about heat dissipation issues, of what i've read the problems are with the Prescott core and not with the interface... this should be looked into.

bga

"LGA is less expensive to produce than both PGA and the similar ball grid array (BGA) interfaces."

i can imagine that this may be true for the chip alone but i can't imagine its true if you include the cost of the socket (which bga avoids) can anyone clarify? Plugwash 00:01, 22 March 2006 (UTC)[reply]

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