Jump to content

User:Jcperez4/3D Computer Processor

From Wikipedia, the free encyclopedia
This is an old revision of this page, as edited by Jcperez4 (talk | contribs) at 19:24, 1 February 2011. The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.

3D Computer Processor

The three-dimensional computer processor, also known as a stacked processor, is a chip that is made of many connected chips stacked on one another. This 3-D chip enhances technology because not like a two-dimensional layout, that can only be miniaturized horizontally, it can be constructed vertically which eliminates the limits of the 2-D chip. The first 3-D chip was named the Rochester Chip after the University of Rochester in which it was invented. It is a very complex piece of technology that is still under development but it will also introduce different features that will advance technology.

Purpose

The smaller the size of a two-dimensional chip, the faster information can travel through it. Researchers believe that eventually the chip will not be able to be miniaturized any farther because as it decreases with size, the amount of heat produced by the chip will negate the gains of making it smaller. This heat is produced by making the circuits of the chip tighter which makes more thermal energy because thinner wires have greater resistance.[1] The 3-D chip was invented to eliminate this problem because the processing components are stacked and connected. By layering these chips, the communication between them would be much faster than having the chips connected side by side, as in a planar layout.[2]

First 3D Processor

The first 3-D processor was created at the University of Rochester by Professor Eby Friedman and his students. The chip runs at a 1.4 GHz and it was designed for optimized vertical processing between the stacked chips which gives the 3-D processor abilities that the traditional one layered ship could not reach.[3] When designing this processor, Professor Friedman and his students knew that they were going to face many difficulties because of the complexity of the design.

Complications

The difficulties of the three-dimensional chip are trying to make all of the layers work in harmony without anything obstacles that interferes a piece of information to go from one layer to another. The chip is like a remote that controls all of the traffic in a country, laying two more countries above the other one and getting a car from one place to another without any difficulty.[4]


Features

  • Synchronicity: When two or more unrelated events occur in an instant.
  • Power distribution
  • Long-distance signaling

References