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Engineering Research Center for Wireless Integrated Microsystems

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NSF Engineering Research Center for Wireless Integrated Microsystems

In 2000, the University of Michigan joined with Michigan State University and Michigan Technological University to form the Engineering Research Center for Wireless Integrated MicroSystems (WIMS ERC). This partnership combines Michigan's programs in sensors and microsystems with Michigan State's leadership in materials, especially in diamond and in carbon nanotubes, and Michigan Tech's world-class expertise in packaging, micromilling, and hot embossing. Funded by the National Science Foundation, with additional contributions from the State of Michigan, the three partnering core universities, other Federal agencies, and a consortium of some twenty companies, the WIMS ERC is merging micropower circuits, wireless interfaces, biomedical and environmental sensors and subsystems, and advanced packaging to create microsystems that will have a pervasive impact on society during the next two decades.

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