Talk:Ball grid array

I put some sample instructions for re-balling and it has been removed! It is useful and relevant information. Please justify.

I just added an xray photo of the BGA joints - does that help? DJGB 09:29, 11 October 2006 (UTC)[reply]

No further comments, so I'm going to remove the cleanup tag DJGB 10:24, 31 October 2006 (UTC)[reply]

History?

If someone knows and have a bit to tell about the development of the BGA package. Please add it & references. Electron9 (talk) 20:40, 22 March 2008 (UTC)[reply]

uBGA/μBGA/micro BGA/TinyBGA(TM)

What about these? For example, what's the exact difference between BGA & uBGA ? Like, if pitch is bigger than 0.5mm it's BGA, but if it's 0.5mm or smaller it's uBGA, or what?

If you remove the solder, from a BGA chip, are there bumps, or just pads ? Like a PCB has it's pads flat against the board substrate. --DaveDodgy (talk) 14:05, 23 April 2008 (UTC)[reply]

Finest pitch

What's the finest pitch a (μ)BGA chip has been made ? As in, the width of the pad & the spacing between pads (centres, not edge to edge).--DaveDodgy (talk) 18:25, 10 May 2008 (UTC)[reply]

Sometimes?

Article: "BGAs do not have this problem, because the solder is sometimes factory-applied to the package in exactly the right amount." So, do they sometimes not have the problem because sometimes this is done and sometimes for other reasons? Or do they sometimes have the problem because the factory didn't apply the solder? --128.197.11.28 (talk) 14:51, 4 August 2008 (UTC)[reply]

External links

Some external links is useless for article. Need cleanup...--Berserkerus (talk) 16:05, 15 November 2008 (UTC)[reply]