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Direct laser interference patterning

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Direct Laser Interference Patterning (DLIP) - a new method.[1] of creating repetitive patterns on the surface of materials by using the interference phenomenon of two or more laser beams.[2] In order to obtain interference, the beam should be split in one of the interference systems. In such an arrangement, the beam is divided, for example, by a beam splitter, special prisms[3] or other element. Then the beams are folded together and form an interference pattern. Sufficiently high power of the laser beam can thus result in the removal of material at the interference maximums thanks to ablation phenomenon, leaving the material intact at the minimums. This way, a repeatable pattern is obtained permanently fixed on the surface of a given material[4]

Advantages of the method

  • It is possible to create microstructures directly on the material on a scale much larger than in the case of direct laser writing (DLW). The image created as a result of interference has dimensions of even the order of single centimeters, which enables the creation of a large surface structure in a single technological step.
  • Another important advantage is that the number of elements in the experimental setup is reduced due to the interference phenomenon.
  • The dimensions of the microstructure are in the order of 100 nm, which is not achievable with direct laser writing.

Types of interferometers

There are many ways to separate the laser beam. Selected types of interferometers based on such elements as:

  • prisms[3]
  • laser beam dividers[2]
  • diffraction gratings[5]
  • DOEs (diffractive optical elements)[6]
  • Lloyd (based on perpendicularly placed and connected mirrors)[7]

References

  1. ^ Yu, Fayou; Li, Ping; Shen, Hao; Mathur, Sanjay; Lehr, Claus-Michael; Bakowsky, Udo; Mücklich, Frank (2005-05-01). "Laser interference lithography as a new and efficient technique for micropatterning of biopolymer surface". Biomaterials. 26 (15): 2307–2312. doi:10.1016/j.biomaterials.2004.07.021. ISSN 0142-9612. PMID 15585233.
  2. ^ a b Czyż, Krzysztof; Marczak, Jan; Major, Roman; Mzyk, Aldona; Rycyk, Antoni; Sarzyński, Antoni; Strzelec, Marek (August 2016). "Selected laser methods for surface structuring of biocompatible diamond-like carbon layers". Diamond and Related Materials. 67: 26–40. Bibcode:2016DRM....67...26C. doi:10.1016/j.diamond.2016.01.013.
  3. ^ a b Czyż, Krzysztof (2016-08-05). "The influence of surface topography elaborated by prism optics based laser interference modification on cell differentiation". Inżynieria Materiałowa. 1 (4): 10–16. doi:10.15199/28.2016.4.2. ISSN 0208-6247.
  4. ^ Marczak, Jan; Kusiński, Jan; Major, Roman; Rycyk, Antoni; Sarzyński, Antoni; Strzelec, Marek; Czyż, Krzysztof (2014). "Laser interference patterning of diamond-like carbon layers for directed migration and growth of smooth muscle cell depositions" (PDF). Optica Applicata; 4/2014; Issn 1429-7507. doi:10.5277/OA140408.
  5. ^ Divliansky, Ivan B.; Shishido, Atsushi; Khoo, Iam-Choon; Mayer, Theresa S.; Pena, David; Nishimura, Suzushi; Keating, Christine D.; Mallouk, Thomas E. (2001-11-19). "Fabrication of two-dimensional photonic crystals using interference lithography and electrodeposition of CdSe". Applied Physics Letters. 79 (21): 3392–3394. Bibcode:2001ApPhL..79.3392D. doi:10.1063/1.1420584. ISSN 0003-6951.
  6. ^ Hauschwitz, Petr; Jochcová, Dominika; Jagdheesh, Radhakrishnan; Cimrman, Martin; Brajer, Jan; Rostohar, Danijela; Mocek, Tomáš; Kopeček, Jaromír; Lucianetti, Antonio; Smrž, Martin (January 2020). "Large-Beam Picosecond Interference Patterning of Metallic Substrates". Materials. 13 (20): 4676. Bibcode:2020Mate...13.4676H. doi:10.3390/ma13204676. PMC 7590036. PMID 33092278.{{cite journal}}: CS1 maint: unflagged free DOI (link)
  7. ^ Boor, Johannes de; Geyer, Nadine; Gösele, Ulrich; Schmidt, Volker (2009-06-15). "Three-beam interference lithography: upgrading a Lloyd's interferometer for single-exposure hexagonal patterning". Optics Letters. 34 (12): 1783–1785. Bibcode:2009OptL...34.1783D. doi:10.1364/OL.34.001783. ISSN 1539-4794. PMID 19529702.
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